Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT8R256K1615TBDCA | 256K x 16 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
UT8R256K1615TBDCC | 256K x 16 SRAM. 15ns access time. Lead finish gold. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
UT8R256K1615TBDCX | 256K x 16 SRAM. 15ns access time. Lead finish factory option. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
UT8R256K1615TBDPC | 256K x 16 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | TBD | 48 | - | - | 94 K |
WE256K8-150CMA | Access time:150 ns; 512K x 8 CMOS EEPROM module | distributor | DIP | 32 | -55°C | 125°C | 621 K |
WE256K8-150CQ | Access time:150 ns; 512K x 8 CMOS EEPROM module | distributor | DIP | 32 | - | - | 621 K |
WE256K8-150CQA | Access time:150 ns; 512K x 8 CMOS EEPROM module | distributor | DIP | 32 | - | - | 621 K |
WE256K8-200CMA | Access time:200 ns; 512K x 8 CMOS EEPROM module | distributor | DIP | 32 | -55°C | 125°C | 621 K |
WE256K8-200CQ | Access time:200 ns; 512K x 8 CMOS EEPROM module | distributor | DIP | 32 | - | - | 621 K |
WE256K8-200CQA | Access time:200 ns; 512K x 8 CMOS EEPROM module | distributor | DIP | 32 | - | - | 621 K |
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