| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| D2570H862 | Wavelengh-selected direct modulated isolated DFB laser module. ST ferrule. ITU freq. 186.2 THz. Center wavelength 1610.06 nm. Peak power 10mW. Dispersion performance 1800ps/nm(100km). | distributor | Metal/ceramic butter | 14 | -40°C | 70°C | 112 K |
| D2570H862 | Wavelengh-selected direct modulated isolated DFB laser module. ST ferrule. ITU freq. 186.2 THz. Center wavelength 1610.06 nm. Peak power 10mW. Dispersion performance 1800ps/nm(100km). | distributor | Metal/ceramic butter | 14 | -40°C | 70°C | 112 K |
| EL2257CN | 125MHz single supply clamping op Amp | distributor | PDIP | 14 | -40°C | 85°C | 1 M |
| EL2257CS | 125MHz single supply clamping op Amp | distributor | SOIC | 14 | -40°C | 85°C | 1 M |
| EL6257CU | 4-channel laser diode driver and oscillator | distributor | QSOP | 24 | 0°C | 70°C | 134 K |
| M38257M1-XXXFS | RAM size: 1024 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 100 | -20°C | 85°C | 994 K |
| M38257M3-XXXFS | RAM size: 1024 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 100 | -20°C | 85°C | 994 K |
| M38257M4-XXXFS | RAM size: 1024 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 100 | -20°C | 85°C | 994 K |
| M38257M4-XXXFS | RAM size: 1024 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 100 | -20°C | 85°C | 994 K |
| M38257M5-XXXFS | RAM size: 1024 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 100 | -20°C | 85°C | 994 K |
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