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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AT28C010-25FM/8831 Megabit (128K x 8) paged CMOS EPROMATMEL-CorporationFlatpack32-55°C125°C657 K
AT28C040-25FC4-Megabit (512K x 8) paged EEPROM, 80mA activ current, 3mA standby currentATMEL-CorporationFlatpack320°C70°C332 K
AT28C040-25FI4-Megabit (512K x 8) paged EEPROM, 80mA activ current, 3mA standby currentATMEL-CorporationFlatpack32-40°C85°C332 K
AT28C040-25FISL7034-Megabit (512K x 8) paged EEPROM, 80mA activ current, 3mA standby current, operation readATMEL-CorporationFlatpack32-55°C125°C332 K
HM5212325FBP-B60128M LVTTL interface SDRAM 100MHz, 1-Mword x 32-bit x 4-bankdistributorBGA1080°C70°C62 K
HM5212325FBPC-B60128M LVTTL interface SDRAM 100 MHz 1-Mword x 32-bit x 4-bankdistributorFBGA900°C70°C58 K
HM5225325F-B60256M LVTTL interface SDRAM 100MHz, 2-Mword x 32-bit x 4-bankdistributorBGA1080°C70°C81 K
HM5225325F-B60256M LVTTL interface SDRAM 100MHz, 2-Mword x 32-bit x 4-bankdistributorBGA1080°C70°C81 K
M30625FGAGPSingle-chip 16-bit CMOS microcomputer. ROM 256 Kbytes, RAM 20K KbytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP80-20°C85°C2 M
M30625FGMGPSingle-chip 16-bit CMOS microcomputer. ROM 256 Kbytes RAM 20 KbytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP80-20°C85°C253 K
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