Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT6116LA25PB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
IDT6116SA25PB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
IDT6168SA25PB | CMOS static RAM | Integrated-Device-Technology-Inc- | DIP | 20 | -55°C | 125°C | 69 K |
IDT7006L25PF | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 263 K |
IDT7006L25PFB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 64 | -55°C | 125°C | 263 K |
IDT7006S25PF | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 263 K |
IDT70824L25PF | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 317 K |
IDT70824S25PF | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 317 K |
IDT72605L25PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
IDT72615L25PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
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