Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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AM7201-25PC | High density first-in first-out (FIFO) 512 x 9-bit CMOS memory, 25ns | AMD-Advanced-Micro-Devices | DIP | 28 | 0°C | 70°C | 804 K |
AM7201-25PC | High density first-in first-out (FIFO) 512 x 9-bit CMOS memory, 25ns | AMD-Advanced-Micro-Devices | DIP | 28 | 0°C | 70°C | 804 K |
KIA278R25PI | 2A 4-Terminal Low Drop(ON/OFF Controllable) | Korea-Electronics-Co--Ltd- | - | - | - | - | 97 K |
VI-25PCX | InputV:150V; outputV:13.8V; 50-200W; 10-40A; DC-DC converter | distributor | - | 9 | -25°C | 85°C | 37 K |
VI-25PIX | InputV:150V; outputV:13.8V; 50-200W; 10-40A; DC-DC converter | distributor | - | 9 | -40°C | 85°C | 37 K |
VI-25PMX | InputV:150V; outputV:13.8V; 50-200W; 10-40A; DC-DC converter | distributor | - | 9 | -55°C | 85°C | 37 K |
W25P222AD-4 | 64K x 32 burst pipelined high-speed CMOS static RAM, LVTTL, 4ns | Winbond-Electronics | TQFP | 100 | 0°C | 70°C | 1 M |
W25P222AD-4A | 64K x 32 burst pipelined high-speed CMOS static RAM, LVTTL, 4.5ns | Winbond-Electronics | TQFP | 100 | 0°C | 70°C | 1 M |
W25P222AF-4 | 64K x 32 burst pipelined high-speed CMOS static RAM, LVTTL, 4ns | Winbond-Electronics | QFP | 100 | 0°C | 70°C | 1 M |
W25P222AF-4A | 64K x 32 burst pipelined high-speed CMOS static RAM, LVTTL, 4.5ns | Winbond-Electronics | QFP | 100 | 0°C | 70°C | 1 M |
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