| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT70V24L25PF | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns, low power | Integrated-Device-Technology-Inc- | TSOP | 100 | 0°C | 70°C | 181 K |
| IDT70V24L25PFI | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns, low power | Integrated-Device-Technology-Inc- | TSOP | 100 | -40°C | 85°C | 181 K |
| IDT70V24S25PF | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns | Integrated-Device-Technology-Inc- | TSOP | 100 | 0°C | 70°C | 181 K |
| PALCE20V8H-25PC/4 | EE CMOS universal programmable array logic, 25ns | Lattice-Semiconductor-Corporation | PDIP | 24 | 0°C | 75°C | 518 K |
| PALCE20V8Q-25PC/4 | EE CMOS universal programmable array logic, 25ns | Lattice-Semiconductor-Corporation | PDIP | 24 | 0°C | 75°C | 518 K |
| PALCE20V8Q-25PI/4 | EE CMOS universal programmable array logic, 25ns | Lattice-Semiconductor-Corporation | PDIP | 24 | -40°C | 85°C | 518 K |
| UT22VP10C-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| WPS512K32-25PJC | 512K x 8 SRAM, 25ns | distributor | PLCC | 68 | 0°C | 70°C | 177 K |
| WPS512K32-25PJI | 512K x 8 SRAM, 25ns | distributor | PLCC | 68 | -40°C | 85°C | 177 K |
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