Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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ATmega325P
| 32-Kbyte self-programming Flash Program Memory, 2-Kbyte SRAM, 1-KByte EEPROM, 8 Channel 10-bit A/D-converter. JTAG interface for on-chip-debug. Up to 16 MIPS throughput at 16 MHz. 1.8 - 5.5 Volt Operation. | ATMEL-Corporation | - | | - | - | 2 M |
ATmega325PV
| 32-Kbyte self-programming Flash Program Memory, 2-Kbyte SRAM, 1-KByte EEPROM, 8 Channel 10-bit A/D-converter. JTAG interface for on-chip-debug. Up to 16 MIPS throughput at 16 MHz. 1.8 - 5.5 Volt Operation. | ATMEL-Corporation | - | | - | - | 2 M |
M25PX32 | 32-Mbit, dual I/O, 4-Kbyte subsector erase, serial Flash memory with 75 MHz SPI bus interface | SGS-Thomson-Microelectronics | - | | - | - | 546 K |
UT22VP10C-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | DIP | 24 | - | - | 287 K |
UT22VP10C-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | distributor | DIP | 24 | - | - | 287 K |
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