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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
UT22VP10C-25WPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorQuad flatpack28--287 K
UT22VP10C-25WPXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional.distributorQuad flatpack28--287 K
UT22VP10E-25WPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorQuad flatpack28--287 K
UT22VP10E-25WPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorQuad flatpack28--287 K
UT22VP10T-25WPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorQuad flatpack28--287 K
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorQuad flatpack28--287 K
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorQuad flatpack28--287 K
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.distributorQuad flatpack28--287 K
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.distributorQuad flatpack28--287 K
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