| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| P83C528FBR | 16 MHz, CMOS single-chip 8-bit microcontroller | Philips-Semiconductors | SDIP | 42 | 0°C | 70°C | 447 K |
| P83C528FFPN | 16 MHz, CMOS single-chip 8-bit microcontroller | Philips-Semiconductors | DIP | 40 | -40°C | 85°C | 447 K |
| RD28F1602C3B70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3B70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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