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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
RD28F1602C3B11016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1602C3B9016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1602C3T11016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1602C3T11016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1602C3T7016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1602C3T9016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1604C3B11016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1604C3B9016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1604C3T11016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110nsIntel-CorporationBGA66-25°C85°C1 M
RD28F1604C3T11016-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110nsIntel-CorporationBGA66-25°C85°C1 M
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