| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MT28F160C3FD-11TET | 1Meg x 16; 3V enhanced + boot bolck flash memory | distributor | FBGA | 46 | -40°C | 85°C | 341 K |
| MT28F160C3FD-9TET | 1Meg x 16; 3V enhanced + boot bolck flash memory | distributor | FBGA | 46 | -40°C | 85°C | 341 K |
| RD28F1602C3B110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3B70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3T70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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