Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
RD28F1602C3B110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3B70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3B90 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3T110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3T110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3T70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3T90 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F1602C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
<< [16] [17] [18] [19] [20] 21 [22] |
---|