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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962F8957701QYAUT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish solder. Total dose 3E5(300KRad).distributorFlatPack84-55°C125°C1 M
5962F8957701QYCUT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish gold. Total dose 3E5(300KRad).distributorFlatPack84-55°C125°C1 M
5962F8957701QYCUT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish gold. Total dose 3E5(300KRad).distributorFlatPack84-55°C125°C1 M
5962F8957701QYXUT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish optional. Total dose 3E5(300KRad).distributorFlatPack84-55°C125°C1 M
5962F8957701VYAUT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML V. Lead finish solder. Total dose 3E5(300KRad).distributorFlatPack84-55°C125°C1 M
5962F8957701VYAUT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML V. Lead finish solder. Total dose 3E5(300KRad).distributorFlatPack84-55°C125°C1 M
M38862F8AFSRAM size: 384bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
M38862F8AGPRAM size: 384bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupQFP80-20°C85°C1 M
M38862F8AHPRAM size: 384bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupQFP80-20°C85°C1 M
M38B72F8H-FPRAM size: 384 bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupQFP100-20°C85°C1 M
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