Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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5962F8957701QYA | UT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish solder. Total dose 3E5(300KRad). | distributor | FlatPack | 84 | -55°C | 125°C | 1 M |
5962F8957701QYC | UT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish gold. Total dose 3E5(300KRad). | distributor | FlatPack | 84 | -55°C | 125°C | 1 M |
5962F8957701QYC | UT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish gold. Total dose 3E5(300KRad). | distributor | FlatPack | 84 | -55°C | 125°C | 1 M |
5962F8957701QYX | UT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML Q. Lead finish optional. Total dose 3E5(300KRad). | distributor | FlatPack | 84 | -55°C | 125°C | 1 M |
5962F8957701VYA | UT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML V. Lead finish solder. Total dose 3E5(300KRad). | distributor | FlatPack | 84 | -55°C | 125°C | 1 M |
5962F8957701VYA | UT1553B BCRT/M bus controller/remote terminal/monitor: SMD. Class designator QML V. Lead finish solder. Total dose 3E5(300KRad). | distributor | FlatPack | 84 | -55°C | 125°C | 1 M |
M38862F8AFS | RAM size: 384bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38862F8AGP | RAM size: 384bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 80 | -20°C | 85°C | 1 M |
M38862F8AHP | RAM size: 384bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 80 | -20°C | 85°C | 1 M |
M38B72F8H-FP | RAM size: 384 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 100 | -20°C | 85°C | 1 M |
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