Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
5962D0053602TXA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
5962D9960702TXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962D9960702TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962L9960702TXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962L9960702TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962L9960702TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962P9960702TXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962P9960702TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
5962P9960702TXX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si) | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
GS2TX-9A | 2 W LAN DC-DC CONVERTER | SGS-Thomson-Microelectronics | - | - | - | - | 42 K |
[1] [2] 3 [4] |
---|