| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10T-25PCA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-25PCA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-25PPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | DIP | 24 | - | - | 287 K |
| UT22VP10T-25PPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | DIP | 24 | - | - | 287 K |
| UT22VP10T-25PPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | distributor | DIP | 24 | - | - | 287 K |
| UT22VP10T-25PPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | distributor | DIP | 24 | - | - | 287 K |
| UT22VP10T-25PPX | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | distributor | DIP | 24 | - | - | 287 K |
| UT22VP10T-25UPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | FlatPack | 24 | - | - | 287 K |
| UT22VP10T-25UPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | distributor | FlatPack | 24 | - | - | 287 K |
| UT22VP10T-25WPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | Quad flatpack | 28 | - | - | 287 K |
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