Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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CY37192VP160-100AC | 3.3V, ISR high-performance CPLDs, 192 macrocells, 100MHz | Cypress-Semiconductor | TQFP | 160 | 0°C | 70°C | 1 M |
M5M27C202VP-12 | 131072-word by 16-bit CMOS erasable and electrically reprogrammable ROM, 120ns | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 40 | -10°C | 80°C | 586 K |
M5M27C202VP-15 | 131072-word by 16-bit CMOS erasable and electrically reprogrammable ROM, 150ns | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 40 | -10°C | 80°C | 586 K |
UT22VP10C-20PCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
UT22VP10C-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
UT22VP10C-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
UT22VP10C-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
UT22VP10C-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
UT22VP10C-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
UT22VP10C-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
UT22VP10C-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
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