Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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DS1307ZN | 64 x 8 Serial Real Time Clock | Dallas-Semiconductor | SOIC | 8 | -40°C | 85°C | 165 K |
ISD33075E | 75 seconds single chip voice record/playback device | Information-Storage-Devices-Inc- | TSOP | 28 | 0°C | 70°C | 1 M |
ISD33075ED | 75 seconds single chip voice record/playback device | Information-Storage-Devices-Inc- | TSOP | 28 | -20°C | 70°C | 1 M |
ISD33075EI | 75 seconds single chip voice record/playback device | Information-Storage-Devices-Inc- | TSOP | 28 | -40°C | 85°C | 1 M |
ISD33075P | 75 seconds single chip voice record/playback device | Information-Storage-Devices-Inc- | PDIP | 28 | 0°C | 70°C | 1 M |
TISP3070H3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 231 K |
TISP3072F3D | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | D | - | - | - | 415 K |
TISP3072F3DR | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | DR | - | - | - | 415 K |
TISP3072F3P | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | P | - | - | - | 415 K |
TISP3072F3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 415 K |
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