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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
FS30ASH-0630A power mosfet for high-speed switching useMitsubishi-Electric-Corporation-Semiconductor-Group-4-55°C150°C38 K
FS30ASJ-0310A power mosfet for high-speed switching useMitsubishi-Electric-Corporation-Semiconductor-Group-4-55°C150°C38 K
FS30ASJ-0630A power mosfet for high-speed switching useMitsubishi-Electric-Corporation-Semiconductor-Group-4-55°C150°C39 K
KM48S16030AT-G/F104M x 8bit x 4 banks synchronous DRAM. Max freq. 66 MHz(CL=2&3). Interface LVTTLSamsung-ElectronicTSOP (II)540°C70°C150 K
KM48S16030AT-G/F84M x 8bit x 4 banks synchronous DRAM. Max freq. 125 MHz(CL=3). Interface LVTTLSamsung-ElectronicTSOP (II)540°C70°C150 K
KM48S16030AT-G/FA4M x 8bit x 4 banks synchronous DRAM. Max freq. 133 MHz(CL=3). Interface LVTTLSamsung-ElectronicTSOP (II)540°C70°C150 K
KM48S16030AT-G/FH4M x 8bit x 4 banks synchronous DRAM. Max freq. 100 MHz(CL=2). Interface LVTTLSamsung-ElectronicTSOP (II)540°C70°C150 K
KM48S16030AT-G/FL4M x 8bit x 4 banks synchronous DRAM. Max freq. 100 MHz(CL=3). Interface LVTTLSamsung-ElectronicTSOP (II)540°C70°C150 K
N80930ADUniversal serial bus microcontroller with burn-in. ROM size 0, RAM size 1 Kbyte, 6 or 12 MHz crystal operationIntel-CorporationPLCC680°C70°C283 K
N83930ADUniversal serial bus microcontroller with burn-in. ROM size 8 Kbytes, RAM size 1 Kbyte, 6 or 12 MHz crystal operationIntel-CorporationPLCC680°C70°C283 K
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