Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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AS7C3256-10PC | 3.3V 32K x 8 CM0S SRAM (common I/O), 10ns access time | Alliance-Semiconductor-Corporation | PDIP | 28 | 0°C | 70°C | 133 K |
AS7C3256-10PC | 3.3V 32K x 8 CM0S SRAM (common I/O), 10ns access time | Alliance-Semiconductor-Corporation | PDIP | 28 | 0°C | 70°C | 133 K |
CSPRC032500430 | Chip scale EMI filter nerwork | California-Micro-Devices | Chip scale | 10 | -40°C | 85°C | 44 K |
HM5212325FBP-B60 | 128M LVTTL interface SDRAM 100MHz, 1-Mword x 32-bit x 4-bank | distributor | BGA | 108 | 0°C | 70°C | 62 K |
HM5212325FBPC-B60 | 128M LVTTL interface SDRAM 100 MHz 1-Mword x 32-bit x 4-bank | distributor | FBGA | 90 | 0°C | 70°C | 58 K |
HM5225325F-B60 | 256M LVTTL interface SDRAM 100MHz, 2-Mword x 32-bit x 4-bank | distributor | BGA | 108 | 0°C | 70°C | 81 K |
HM5225325F-B60 | 256M LVTTL interface SDRAM 100MHz, 2-Mword x 32-bit x 4-bank | distributor | BGA | 108 | 0°C | 70°C | 81 K |
MSM27C3252CZ | 2,097,152-word x 16-bit or 4,194,304-word x 8-bit one time PROM | distributor | SOP | 44 | 0°C | 70°C | 90 K |
MSM27C3252CZ | 2,097,152-word x 16-bit or 4,194,304-word x 8-bit one time PROM | distributor | TSOP | 48 | 0°C | 70°C | 90 K |
MSM27C3255CZ | 1,048,576-double word x 32-bit or 2,097,152-word x 16-bit one time PROM | distributor | SSOP | 70 | 0°C | 70°C | 91 K |
MSM27V3255CZ | 1,048,576-double word x 32-bit or 2,097,152-word x 16-bit one time PROM | distributor | SSOP | 70 | 0°C | 70°C | 100 K |
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