Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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MSC23408CL-80DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
MSC23409C-60DS9 | 4,194,304-word x 9-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 255 K |
MSC23409C-70DS9 | 4,194,304-word x 9-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 255 K |
MSC23409C-80DS9 | 4,194,304-word x 9-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 255 K |
MSC23409CL-60DS9 | 4,194,304-word x 9-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 255 K |
MSC23409CL-70DS9 | 4,194,304-word x 9-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 255 K |
MSC23409CL-80DS9 | 4,194,304-word x 9-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 255 K |
MSM534001E | 524,288-word x 8-bit Mask ROM | distributor | DIP | 32 | 0°C | 70°C | 66 K |
MSM534001E | 524,288-word x 8-bit Mask ROM | distributor | SOP | 32 | 0°C | 70°C | 66 K |
MSM534001E | 524,288-word x 8-bit Mask ROM | distributor | TSOP | 32 | 0°C | 70°C | 66 K |
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