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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT6116LA35SOCMOS static RAM 16K (2K x 8 bit)Integrated-Device-Technology-Inc-SOIC240°C70°C91 K
IDT6116LA35SOBCMOS static RAM 16K (2K x 8 bit)Integrated-Device-Technology-Inc-SOIC24-55°C125°C91 K
IDT6116SA35SOCMOS static RAM 16K (2K x 8 bit)Integrated-Device-Technology-Inc-SOIC240°C70°C91 K
IDT6116SA35SOBCMOS static RAM 16K (2K x 8 bit)Integrated-Device-Technology-Inc-SOIC24-55°C125°C91 K
IDT6168SA35SOBCMOS static RAMIntegrated-Device-Technology-Inc-SOIC20-55°C125°C69 K
IDT7200LA35SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7200LA35SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7201LA35SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7202LA35SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7204L35SOCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-DIP200°C70°C147 K
IDT7204S35SOCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-DIP200°C70°C147 K
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