| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962-0323602QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962-0323602QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962-0323602QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962-0323602QXX | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962-0323602VXA | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962-0323602VXC | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962-0323602VXX | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
| 5962D0053601TXA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
| 5962D0053602TXA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
| 5962D0053604TXA | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
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