| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 54FCT374AFMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | distributor | Flatpak | 20 | -55°C | 125°C | 213 K |
| 54FCT374ALMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | distributor | LCC | 20 | -55°C | 125°C | 213 K |
| 54FCT374APMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | distributor | Plastic DIP | 20 | -55°C | 125°C | 213 K |
| 54FCT374ASMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | distributor | SOIC | 20 | -55°C | 125°C | 213 K |
| 54FCT374ASMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | distributor | SOIC | 20 | -55°C | 125°C | 213 K |
| UT54ACS374PCA | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
| UT54ACS374PCA | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
| UT54ACS374UCC | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
| UT54ACS374UCX | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
| UT54ACTS374PCA | RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
| << [149] [150] [151] [152] [153] 154 [155] [156] [157] |
|---|
