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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
M38002E2FPSingle-chip 8-bit microcfomputer. One time PROM version. PROM 8192 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP64-20°C85°C4 M
M38002E4-XXXFPSingle-chip 8-bit microcfomputer. One time PROM version. PROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP64-20°C85°C4 M
M38002E4-XXXSPSingle-chip 8-bit microcfomputer. One time PROM version. PROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SDIP64-20°C85°C4 M
M38002E4FPSingle-chip 8-bit microcfomputer. One time PROM version. PROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP64-20°C85°C4 M
M38002E4FSSingle-chip 8-bit microcfomputer. EPROM version. PROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupCeramic LCC64-20°C85°C4 M
M38002E4SPSingle-chip 8-bit microcfomputer. One time PROM version. PROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SDIP64-20°C85°C4 M
M38002E4SSSingle-chip 8-bit microcfomputer. EPROM version. PROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupCeramic DIP64-20°C85°C4 M
M38002M4-XXXFPSingle-chip 8-bit microcfomputer. Mask ROM version. ROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP64-20°C85°C4 M
M38002M4-XXXSPSingle-chip 8-bit microcfomputer. Mask ROM version. ROM 16384 bytes, RAM 384 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SDIP64-20°C85°C4 M
M38003M6-XXXSPSingle-chip 8-bit microcfomputer. Mask ROM version. ROM 24576 bytes, RAM 512 bytesMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SDIP64-20°C85°C4 M
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