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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
LH538700ADCMOS 8M(1M X 8) Mask-Programmable ROMSharpDIP320°C70°C58 K
LH538700ANCMOS 8M(1M X 8) Mask-Programmable ROMSharpSOP320°C70°C58 K
LH538700ASCMOS 8M(1M X 8) Mask-Programmable ROMSharpTSOP320°C70°C58 K
LH538700ASRCMOS 8M(1M X 8) Mask-Programmable ROMSharpTSOP320°C70°C58 K
M38749EFDGPSingle-chip 8-bit CMOS microcomputer. PROM 61440 bytes, RAM 2048 bytes. One time PROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SSOP80-40°C85°C1 M
M38749EFFSSingle-chip 8-bit CMOS microcomputer. PROM 61440 bytes, RAM 2048 bytes. EPROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupCeramic LCC80-20°C85°C1 M
M38749MFFSingle-chip 8-bit CMOS microcomputer. ROM 61440 bytes, RAM 2048 bytes. Mask ROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP80-20°C85°C1 M
MAX3387ECUG3.0V, +-15kV ESD-protected, autoshutdown plus RS-232 transceiver for PDAs and cell phohes.Maxim-Integrated-ProducsTSSOP240°C70°C181 K
MAX3387ECUG3.0V, +-15kV ESD-protected, autoshutdown plus RS-232 transceiver for PDAs and cell phohes.Maxim-Integrated-ProducsTSSOP240°C70°C181 K
PI2BV3877L2.5V, 10-bit, 2-port 266MHZ DDR busSwitchdistributorTSSOP240°C85°C339 K
PI2BV3877Q2.5V, 10-bit, 2-port 266MHZ DDR busSwitchdistributorQSOP240°C85°C339 K
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