| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| DT28F160F3B120 | Fast boot block flash memory 16 Mbit. Access speed 120 ns | Intel-Corporation | SSOP | 56 | -40°C | 85°C | 277 K |
| DT28F800F3B120 | Fast boot block flash memory 8 Mbit. Access speed 120 ns | Intel-Corporation | SSOP | 56 | -40°C | 85°C | 277 K |
| G1213B1N000 | Liquid crystal display module | Seiko-Epson-Corporation | - | 20 | -20°C | 70°C | 1 M |
| GT28F008B3B110 | Smart 3 advanced boot block 8-Mbit flash memory family. Access speed 110 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 300 K |
| GT28F800B3B110 | Smart 3 advanced boot block 8 Mbit flash memory family. Access speed 110 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 300 K |
| MSC23B136D-60BS4 | 1,048,576 word by 36-bit dynamic RAM module | distributor | - | 72 | 0°C | 70°C | 298 K |
| MSC23B136D-60DS4 | 1,048,576 word by 36-bit dynamic RAM module | distributor | - | 72 | 0°C | 70°C | 298 K |
| MSC23B136D-70BS4 | 1,048,576 word by 36-bit dynamic RAM module | distributor | - | 72 | 0°C | 70°C | 298 K |
| MSC23B136D-70DS4 | 1,048,576 word by 36-bit dynamic RAM module | distributor | - | 72 | 0°C | 70°C | 298 K |
| TE28F400B3B110 | Smart 3 advanced boot block 4-Mbit flash memory family. Access speed 110 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 300 K |
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