| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ALE73B12 | LE relay. 16A power relay for micro wave oven. Coil voltage 12 V DC. Class B. High sensitivity type. 1 form A (High sensitivity: 200 mW) . TMP type/PCB side three terminals. | distributor | - | 5 | -40°C | 85°C | 121 K |
| ALE73B18 | LE relay. 16A power relay for micro wave oven. Coil voltage 18 V DC. Class B. High sensitivity type. 1 form A (High sensitivity: 200 mW) . TMP type/PCB side three terminals. | distributor | - | 5 | -40°C | 85°C | 121 K |
| LR-3B12C | Phototransistor. Collector-emitter voltage 30 V. Emitter-collector voltage 6 V. Collector current 20 mA. Power dissipation 100 mW. | distributor | - | 2 | -20°C | 85°C | 38 K |
| M74HC03B1R | QUAD 2-INPUT OPEN DRAIN NAND GATE | SGS-Thomson-Microelectronics | - | - | - | - | 179 K |
| M74HC643B1R | OCTAL BUS TRANSCEIVER (3-STATE) | SGS-Thomson-Microelectronics | - | - | - | - | 338 K |
| M74HC73B1R | DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | SGS-Thomson-Microelectronics | - | - | - | - | 323 K |
| M74HCT4053B1R | TRIPLE 2-CHANNEL ANALOG MULTIPLEXER/DEMULTIPLEXER | SGS-Thomson-Microelectronics | - | - | - | - | 233 K |
| RD28F1602C3B110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3B110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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