| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962-8863402UX | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | PGA | 28 | -55°C | 125°C | 445 K |
| 5962-8863402XX | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | PDIP | 28 | -55°C | 125°C | 445 K |
| 5962-8863402YX | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
| 5962-8863402ZX | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | FLATPACK | 28 | -55°C | 125°C | 445 K |
| MK4027J-1 | 4096x1-bit dynamic RAM, 120ns acces time. 320ns cycle. | distributor | DIP | 16 | 0°C | 70°C | 970 K |
| MK4027J-2 | 4096x1-bit dynamic RAM, 150ns acces time, 320ns cycle. | distributor | DIP | 16 | 0°C | 70°C | 970 K |
| MK4027N-1 | 4096x1-bit dynamic RAM, 120ns acces time. 320ns cycle. | distributor | DIP | 16 | 0°C | 70°C | 970 K |
| ULLC0402FC12C | 12.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC15C | 15.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC24C | 24.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
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