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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
U0408FC15C15.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C115 K
U0408FC24C24.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C115 K
U0408FC36C36.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C115 K
ULC0408FC05C5.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC12C12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC15C15.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC24C24.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC3.3C3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
Z84C4408PECSerial input/output controller, 8MHzdistributorPDIP40-40°C100°C848 K
Z84C4408PECSerial input/output controller, 8MHzdistributorPDIP40-40°C100°C848 K
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