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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
GLT440L16-40TC40ns; 256k x 16 CMOS dynamic RAM with extended data outputdistributorTSOP44-40°C85°C411 K
GLT440L16-50J450ns; 256k x 16 CMOS dynamic RAM with extended data outputdistributorSOJ40-40°C85°C411 K
GLT440L16-50TC50ns; 256k x 16 CMOS dynamic RAM with extended data outputdistributorTSOP44-40°C85°C411 K
IDT72V3640L10PF3.3V, high-density, low power, 1024 x 36-bit FIFO, 10nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3640L15PF3.3V, high-density, low power, 1024 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3640L15PFI3.3V, high-density, low power, 1024 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP128-40°C85°C567 K
MCM40L100S101Mx40 bit dynamyc random access memory module. Fast access time 100ns.MotorolaSIMM720°C70°C545 K
MCM40L100S801Mx40 bit dynamyc random access memory module. Fast access time 80ns.MotorolaSIMM720°C70°C545 K
OPB840L11Slotted optical switchdistributor-4-40°C85°C386 K
OPB840L15Slotted optical switchdistributor-4-40°C85°C386 K
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