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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
GLT44108-40J440ns; 512K x 8 CMOS dynamic RAM with fast page modedistributorSOJ280°C70°C399 K
GLT44108-50J450ns; Ultra low power 128k x 8 CMOS SRAMdistributorTSOP32-40°C85°C399 K
GLT44108-60J460ns; Ultra low power 128k x 8 CMOS SRAMdistributorTSOP32-40°C85°C399 K
K4R441869AM-CG6256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz.Samsung-ElectronicmicroBGA(mirrored CS620°C70°C3 M
K4R441869AM-CK7256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz.Samsung-ElectronicmicroBGA(mirrored CS620°C70°C3 M
K4R441869AN-CG6256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz.Samsung-ElectronicmicroBGA(normal CSP)620°C70°C3 M
K4R441869AN-CK7256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz.Samsung-ElectronicmicroBGA(normal CSP)620°C70°C3 M
K4R441869AN-CK8256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz.Samsung-ElectronicmicroBGA(normal CSP)620°C70°C3 M
MSP4418GMultistandard sound processorMicronas-IntermetallPQFP640°C70°C570 K
MSP4418GMultistandard sound processorMicronas-IntermetallPDIP640°C70°C570 K
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