| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| FU-445SDF-1M1C | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| FU-445SDF-1M2B | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| FU-445SDF-V1M1C | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| FU-445SDF-V1M2B | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| FU-445SDF-W1M1C | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| FU-445SDF-W1M2B | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| FU-445SDF-W1M2B | Uncooled DFB-LD module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 8 | -5°C | 70°C | 108 K |
| MH16V6445BWJ-5 | 1073741824-bit (16777216-word by 64-bit) dynamic RAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 127 K |
| MH16V6445BWJ-6 | 1073741824-bit (16777216-word by 64-bit) dynamic RAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 127 K |
| MH8V6445BWZJ-5 | 536870912-bit (8388608-word by 64-bit) dynamic RAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 121 K |
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