Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
MG64PB02 | 0.25mm embedded DRAM/Customer Structured Array | distributor | TQFP | 100 | -40°C | 85°C | 267 K |
MG64PB04 | 0.25mm embedded DRAM/Customer Structured Array | distributor | TQFP | 100 | -40°C | 85°C | 267 K |
MG64PB08 | 0.25mm embedded DRAM/Customer Structured Array | distributor | TQFP | 100 | -40°C | 85°C | 267 K |
MG64PB10 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 208 | -40°C | 85°C | 267 K |
MG64PB10 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 208 | -40°C | 85°C | 267 K |
MG64PB10 | 0.25mm embedded DRAM/Customer Structured Array | distributor | TQFP | 100 | -40°C | 85°C | 267 K |
MG64PB12 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 144 | -40°C | 85°C | 267 K |
MG64PB12 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 208 | -40°C | 85°C | 267 K |
MG64PB12 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 208 | -40°C | 85°C | 267 K |
MG74PB42 | CSA series | distributor | BGA | 560 | -40°C | 85°C | 278 K |
<< [9] [10] [11] [12] [13] 14 [15] [16] [17] [18] [19] >> |
---|