| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| QL3025-4PB256C | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 256 | 0°C | 70°C | 582 K |
| QL3025-4PB256I | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 256 | -40°C | 85°C | 582 K |
| QL3025-4PB256M | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 256 | -55°C | 125°C | 582 K |
| QL3040-4PB456C | 40,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 456 | 0°C | 70°C | 477 K |
| QL3040-4PB456I | 40,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 456 | -40°C | 85°C | 477 K |
| QL6500-4PB516I | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -40°C | 85°C | 1 M |
| QL6500-4PB516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
| QL6600-4PB516C | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | 0°C | 70°C | 1 M |
| QL6600-4PB516I | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -40°C | 85°C | 1 M |
| QL6600-4PB516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
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