| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MH32DS64PFJ-6 | 2147483648-bit synchronous DRAM module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 144 | 0°C | 70°C | 690 K |
| MH32DS64PFJ-7 | 2147483648-bit synchronous DRAM module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 144 | 0°C | 70°C | 690 K |
| MH32DS64PFJ-7L | 2147483648-bit synchronous DRAM module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 144 | 0°C | 70°C | 690 K |
| QL3004-4PF100C | 4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | 0°C | 70°C | 339 K |
| QL3004-4PF100I | 4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | -40°C | 85°C | 339 K |
| QL3004-4PF100M | 4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | -55°C | 125°C | 339 K |
| QL3004E-4PF100C | 4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | 0°C | 70°C | 193 K |
| QL3004E-4PF100I | 4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | -40°C | 85°C | 193 K |
| QL3004E-4PF100M | 4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | -55°C | 125°C | 193 K |
| QL3012-4PF100C | 12,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 100 | 0°C | 70°C | 347 K |
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