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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962D0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962D0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962L0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962L0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962L9960704QXA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962L9960704QXC512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 5E4(50krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604QXX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
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