Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
5962F9475404QXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962G9475404QXA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962G9475404QXC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962G9475404QXX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962G9475404QXX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962R9475404QXA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962R9475404QXX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
<< [3] [4] [5] [6] [7] 8 |
---|