Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT70824L25G | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 317 K |
IDT70824L25PF | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 317 K |
IDT70V24L25G | High-speed 3.3V 4K x 16 dual-port static RAM | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 281 K |
IDT70V24L25J | High-speed 3.3V 4K x 16 dual-port static RAM | Integrated-Device-Technology-Inc- | PLCC | 84 | 0°C | 70°C | 281 K |
IDT70V24L25PF | High-speed 3.3V 4K x 16 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 100 | 0°C | 70°C | 281 K |
IDT7164L25TP | CMOS static RAM 64K (8K x 8-bit) | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 104 K |
IDT72404L25D | CMOS parallel fifo 64 x 4-bit and 64 x 5-bit | Integrated-Device-Technology-Inc- | DIP | 18 | 0°C | 70°C | 95 K |
IDT72404L25DB | CMOS parallel fifo 64 x 4-bit and 64 x 5-bit | Integrated-Device-Technology-Inc- | DIP | 18 | -55°C | 125°C | 95 K |
IDT72404L25P | CMOS parallel fifo 64 x 4-bit and 64 x 5-bit | Integrated-Device-Technology-Inc- | DIP | 18 | 0°C | 70°C | 95 K |
IDT72404L25PB | CMOS parallel fifo 64 x 4-bit and 64 x 5-bit | Integrated-Device-Technology-Inc- | DIP | 18 | -55°C | 125°C | 95 K |
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