Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
IDT70V24L25GI | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns, low power | Integrated-Device-Technology-Inc- | PGA | 84 | -40°C | 85°C | 181 K |
IDT70V24L25JI | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns, low power | Integrated-Device-Technology-Inc- | PLCC | 84 | -40°C | 85°C | 181 K |
IDT70V24L25PF | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns, low power | Integrated-Device-Technology-Inc- | TSOP | 100 | 0°C | 70°C | 181 K |
IDT70V24L25PFI | High-speed 3.3V 4K x 16 dual-port static RAM, 25ns, low power | Integrated-Device-Technology-Inc- | TSOP | 100 | -40°C | 85°C | 181 K |
IDT7204L25D | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7204L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7204L25TD | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7204L25TP | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
T14L256A-8J | 8ns; -0.5 to 4.6V; 1.0W; 32 x 8 high speed CMOS static RAM | distributor | SOJ | 28 | 0°C | 70°C | 72 K |
T14L256A-8J | 8ns; -0.5 to 4.6V; 1.0W; 32 x 8 high speed CMOS static RAM | distributor | SOJ | 28 | 0°C | 70°C | 72 K |
[1] [2] [3] [4] 5 [6] |
---|