Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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5962-8864501XC | Remote terminal multi-protocol. Flow QML Q. Lead finish gold. | distributor | PGA | 84 | - | - | 26 K |
5962-8864501XC | Remote terminal multi-protocol. Flow QML Q. Lead finish gold. | distributor | PGA | 84 | - | - | 26 K |
5962-8864501XC | Remote terminal multi-protocol. Flow QML Q. Lead finish gold. | distributor | PGA | 84 | - | - | 26 K |
5962-8864501YC | Remote terminal multi-protocol. Flow QML Q. Lead finish gold. | distributor | FlatPack | 84 | - | - | 26 K |
5962R-0323501QUA | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish hot solder dipped. Total dose 100K rad(Si). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
5962R-0323501QUC | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish gold. Total dose 100K rad(Si). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
5962R-0323501QUC | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish gold. Total dose 100K rad(Si). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
5962R-0323501QUX | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish factory option. Total dose 100K rad(Si). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
5962R-0323501VUA | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class V. Lead finish hot solder dipped. Total dose 100K rad(Si). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
5962R-0323501VUC | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class V. Lead finish gold. Total dose 100K rad(Si). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
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