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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
M27512-20F1NMOS 512 Kbit (64Kb x 8) UV EPROM, 200nsSGS-Thomson-MicroelectronicsFDIP280°C70°C90 K
M27512-20F6NMOS 512 Kbit (64Kb x 8) UV EPROM, 200nsSGS-Thomson-MicroelectronicsFDIP28-40°C85°C90 K
M27512-25F1NMOS 512 Kbit (64Kb x 8) UV EPROM, 250nsSGS-Thomson-MicroelectronicsFDIP280°C70°C90 K
M27512-25F6NMOS 512 Kbit (64Kb x 8) UV EPROM, 250nsSGS-Thomson-MicroelectronicsFDIP28-40°C85°C90 K
M27512-2F1NMOS 512 Kbit (64Kb x 8) UV EPROM, 200nsSGS-Thomson-MicroelectronicsFDIP280°C70°C90 K
M27C512-25B6512 Kbit (64Kb x 8) EPROM, 5V, 250nsSGS-Thomson-MicroelectronicsPDIP28-40°C85°C114 K
UT8Q512-20ICA512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow.distributorFlatpack shielded36-55°C125°C127 K
UT8Q512-20ICA512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow.distributorFlatpack shielded36-55°C125°C127 K
UT8Q512-20ICC512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Military temperature range flow.distributorFlatpack shielded36-55°C125°C127 K
UT8Q512-20IWA512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish factory option. Extended industrial temperature range flow.distributorFlatpack shielded36-40°C125°C127 K
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