Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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M27512-20F1 | NMOS 512 Kbit (64Kb x 8) UV EPROM, 200ns | SGS-Thomson-Microelectronics | FDIP | 28 | 0°C | 70°C | 90 K |
M27512-20F6 | NMOS 512 Kbit (64Kb x 8) UV EPROM, 200ns | SGS-Thomson-Microelectronics | FDIP | 28 | -40°C | 85°C | 90 K |
M27512-25F1 | NMOS 512 Kbit (64Kb x 8) UV EPROM, 250ns | SGS-Thomson-Microelectronics | FDIP | 28 | 0°C | 70°C | 90 K |
M27512-25F6 | NMOS 512 Kbit (64Kb x 8) UV EPROM, 250ns | SGS-Thomson-Microelectronics | FDIP | 28 | -40°C | 85°C | 90 K |
M27512-2F1 | NMOS 512 Kbit (64Kb x 8) UV EPROM, 200ns | SGS-Thomson-Microelectronics | FDIP | 28 | 0°C | 70°C | 90 K |
M27C512-25B6 | 512 Kbit (64Kb x 8) EPROM, 5V, 250ns | SGS-Thomson-Microelectronics | PDIP | 28 | -40°C | 85°C | 114 K |
UT8Q512-20ICA | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512-20ICA | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512-20ICC | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512-20IWA | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish factory option. Extended industrial temperature range flow. | distributor | Flatpack shielded | 36 | -40°C | 125°C | 127 K |
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