| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT8Q512-20IPC | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Prototype flow. | distributor | FlatPack | 36 | - | - | 127 K |
| UT8Q512-20UPC | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Prototype flow. | distributor | Flatpack shielded | 36 | - | - | 127 K |
| UT9Q512-20ICA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
| UT9Q512-20ICC | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
| UT9Q512-20ICC | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
| UT9Q512-20IWA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
| UT9Q512-20IWC | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
| UT9Q512-20UCA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
| UT9Q512-20UCC | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
| UT9Q512-20UWA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
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