Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT8Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 3.3V operation. Lead finish gold. Prototype flow. | distributor | CQFP | 68 | -40°C | 125°C | 135 K |
UT8Q512K32-SWC | 512K32 16Megabit SRAM MCM. 25ns access time, 3.3V operation. Lead finish gold. | distributor | CQFP | 68 | -40°C | 125°C | 135 K |
UT8Q512K32-SWC | 512K32 16Megabit SRAM MCM. 25ns access time, 3.3V operation. Lead finish gold. | distributor | CQFP | 68 | -40°C | 125°C | 135 K |
UT8R512K8-15UCA | 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
UT8R512K8-15UCA | 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
UT8R512K8-15UCC | 512K x 18 SRAM. 15ns access time. Lead finish hot gold. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
UT8R512K8-15UWA | 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 109 K |
UT8R512K8-15UWC | 512K x 18 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 109 K |
UT8R512K8-15UWX | 512K x 18 SRAM. 15ns access time. Lead finish factory option. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 109 K |
UT9Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. | distributor | CQFP | 68 | - | - | 135 K |
UT9Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. | distributor | CQFP | 68 | - | - | 135 K |
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