| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| DS2251T-128-16 | 128K Soft Microcontroller Module | Dallas-Semiconductor | SIMM128kbytes | 72 | 0°C | 70°C | 654 K |
| DS2251T-32-16 | 128K Soft Microcontroller Module | Dallas-Semiconductor | SIMM32kbytes | 72 | 0°C | 70°C | 654 K |
| DS2251T-64-16 | 128K Soft Microcontroller Module | Dallas-Semiconductor | SIMM64kbytes | 72 | 0°C | 70°C | 654 K |
| IDT54FCT151TE | Fast CMOS 8-input multiplexer | Integrated-Device-Technology-Inc- | CERPACK | 16 | -55°C | 125°C | 117 K |
| IDT54FCT151TE | Fast CMOS 8-input multiplexer | Integrated-Device-Technology-Inc- | CERPACK | 16 | -55°C | 125°C | 117 K |
| IDT74FCT151TE | Fast CMOS 8-input multiplexer | Integrated-Device-Technology-Inc- | CERPACK | 16 | -40°C | 85°C | 117 K |
| IDT74FCT151TEB | Fast CMOS 8-input multiplexer | Integrated-Device-Technology-Inc- | CERPACK | 16 | -40°C | 85°C | 117 K |
| UPC8151TB | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
| UPC8151TB-E3 | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
| UPC8151TB-E3 | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
| W9951TF | Trip 8 bit DAC-muxwitngenlock PLL & analogcolor key | Winbond-Electronics | PQFP64 | 64 | - | - | 21 K |
| [1] 2 [3] [4] [5] [6] [7] [8] [9] [10] |
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