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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962P0053601TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962P0053601TXX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962P0053602TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053602TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053602TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053603TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962P0053604TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604TXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604TXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
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