Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT54ACS109PCA | RadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACS109PCC | RadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACS109PCX | RadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACS109UCA | RadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
UT54ACS109UCC | RadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
UT54ACTS109PCX | RadHard MSI. Dual J-K flip-flop. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACTS109PCX | RadHard MSI. Dual J-K flip-flop. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACTS109UCA | RadHard MSI. Dual J-K flip-flop. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
UT54ACTS109UCC | RadHard MSI. Dual J-K flip-flop. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
UT54ACTS109UCX | RadHard MSI. Dual J-K flip-flop. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
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