| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| LP62S16256FU-55LLI | 55ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | CSP | 44 | 0°C | 70°C | 168 K |
| LP62S16256FU-55LLT | 55ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | CSP | 48 | 0°C | 70°C | 168 K |
| LP62S16256FU-70LLI | 70ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | CSP | 44 | 0°C | 70°C | 168 K |
| LP62S16256FU-70LLT | 70ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | CSP | 48 | 0°C | 70°C | 168 K |
| LP62S16256FV-55LLT | 55ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | TSOP | 44 | 0°C | 70°C | 168 K |
| LP62S16256FV-70LLI | 70ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | TSOP | 44 | 0°C | 70°C | 168 K |
| LP62S16256FV-70LLT | 70ns; operating current:40mA; standby current:10uA; 256K x 16bit low voltage CMOS SRAM | distributor | TSOP | 44 | 0°C | 70°C | 168 K |
| MC-4R256FKE6D-840 | 256M; 800MHz direct rambus dynamic RAM SO-RIMM module | distributor | FBGA | - | - | - | 490 K |
| MC-4R256FKE8D-840 | 512M; 800MHz direct rambus dynamic RAM SO-RIMM module | distributor | FBGA | - | - | - | 128 K |
| MC-4R256FKK6K-840 | 256M; 800MHz direct rambus dynamic RAM RIMM module | distributor | FBGA | - | - | - | 91 K |
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