| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10C-25PCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-25PCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-25PCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15PCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15PCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15PCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15PCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25PCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25PCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
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