Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT22VP10T-25PPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | DIP | 24 | - | - | 287 K |
UT22VP10T-25PPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | distributor | DIP | 24 | - | - | 287 K |
UT22VP10T-25PPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | distributor | DIP | 24 | - | - | 287 K |
UT22VP10T-25PPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | distributor | DIP | 24 | - | - | 287 K |
UT22VP10T-25PPX | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | distributor | DIP | 24 | - | - | 287 K |
UT28F64LVC55PPC | Radiation-hardenet 3.3V, 8K x 8 PROM. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Phototype. Lead finish gold. | distributor | DIP | 28 | -55°C | 125°C | 152 K |
UT28F64LVC55PPC | Radiation-hardenet 3.3V, 8K x 8 PROM. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Phototype. Lead finish gold. | distributor | DIP | 28 | -55°C | 125°C | 152 K |
UT28F64LVC55PPX | Radiation-hardenet 3.3V, 8K x 8 PROM. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Phototype. Lead finish optional. | distributor | DIP | 28 | -55°C | 125°C | 152 K |
UT6716455PPA | 64K SRAM, 8Kx8. 55ns access time Lead finish solder. Prototype flow. | distributor | DIP | 28 | - | - | 6 M |
UT6716455PPC | 64K SRAM, 8Kx8. 55ns access time Lead finish gold. Prototype flow. | distributor | DIP | 28 | - | - | 6 M |
UT6716455PPX | 64K SRAM, 8Kx8. 55ns access time Lead finish optional. Prototype flow. | distributor | DIP | 28 | - | - | 6 M |
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