| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10C-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-15WCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-15WCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-15WCX | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10T-15WCX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| [1] [2] [3] [4] 5 [6] |
|---|
